A team from global defense company Northrop Grumman has conducted a study with metal additive manufacturing specialist Optomec’s Aerosol Jet Printing (AJP) technology. Researchers have demonstrated a new method of using AJP to fabricate interconnects on semiconductor chips. After several radiofrequency and reliability tests, the high performance of interconnects proves 3D printing to be a competent alternative to existing semiconductor technologies.

 

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