Presentation to Highlight Recent Developments in Aerosol Jet Technology for High Density, 3-D Interconnects for Multi-Chip Packaging

Albuquerque, New Mexico, 09 March 2010: Optomec announced today that Mike O’Reilly, Optomec’s Aerosol Jet Product Manager will give a presentation on Aerosol Jet Deposition Technology for High Density, 3-D Interconnects for Multi-Chip Packaging at the IMAPS Device Packaging Conference in Scottsdale, Arizona on March 11. The conference will be held from March 9-11th at the Radisson Fort McDowell Resort and Casino in Scottsdale/Fountain Hills, Arizona. For detailed information on the conference, go to

Optomec and Vertcial Circuits Inc. have partnered together in developing a complete solution which addresses evolving 3-D semiconductor packaging complexities. Optomec’s patented Aerosol Jet technology is a maskless, non-contact material deposition system used to enable 3-D semiconductor packaging. Mr. O’Reilly’s presentation will discuss the results of printing high density, 3-D interconnects printed on stacked die multi-chip packages which incorporate video, communications and memory modules. Such packages are critical for meeting the increasing functional requirements of SmartPhones, personal entertainment, and other mobile devices. Mr. O’Reilly’s presentation will explain how the Aerosol Jet system is used to deposit silver nanoparticle ink interconnects along the staircased sidewalls of staggered multi-chip die stacks. High aspect ratio interconnects with 30-micron line width and greater than 10-micron line height are demonstrated. After printing, the silver inks are cured at ~200ºC for ~30 minutes, which gives interconnect resistances below one-Ohm (< 5 microns-Ohm*cm). Up to 8 die stacks, with a total stack height of approximately 1 mm, have been printed on without any requirement to adjust the print head height. The Aerosol Jet print system has a working distance of several mm above the substrate surface which means that Z-height adjustments may not be required during the printing process. Multiplexed print nozzles are used to achieve production throughputs of greater than two interconnects per second per nozzle. Based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies. For more information on Aerosol Jet systems click here. Optomec is the world-leading provider of additive manufacturing solutions for high-performance applications in the Electronics, Solar, Medical, and Aerospace & Defense markets. These systems utilize Optomec's patented Aerosol Jet Printed Electronics technology and LENS powder-metal fabrication technology. The company has a global customer base of more than 100 users that includes many industry-leading manufacturers.