January 28, 2021
Virtual Event
IEEE Electronics Packaging Society
“High Performance & Reliable Aerosol Jet Printed 3D Interconnects for Bare Die and Components”
InnoLAE 2021
March 10, 2021
TechBLick
March 23-25, 2021
Virtual Exhibition
LOPEC 2021
April 12-15, 2021
iMAPS Device Packaging
April 26-29, 2021
Chicago, IL
RAPID + TCT
“RAPID + TCT is North America’s largest and most important additive manufacturing event.”
April 27-29, 2021
Orlando, FL
MRO Americas
“An in-depth overview on what’s new in tech-ops, their challenges and issues, and expectations from the aftermarket.”