Aerosol-Jet Printed Interconnects for 60-Gb/s CMOS Driver and Microring Modulator Transmitter Assembly
Ahmed Elmogi; Hannes Ramon; Joris Lambrecht; Peter Ossieur; Guy Torfs; Jeroen Missinne; Peter De Heyn; Yoojin Ban; Marianna Pantouvaki; Joris Van Campenhout; Geert Van Steenberge
IEEE Photonics Technology Letters ( Volume: 30, Issue: 22, Nov.15, 15 2018)
Abstract
We developed an aerosol-jet printing technique to realize an optical transmitter assembly of a microring modulator and a high-speed CMOS driver in which the bonding wires are replaced by aerosol-jet printed silver interconnects. First, the technology is characterized by printing coplanar waveguides (CPWs) test structures on glass and epoxy in order to fully investigate the electro-magnetic behavior of the aerosol-jet printed interconnects. The printed CPWs on glass and epoxy showed a low attenuation of 0.57 and 0.76 dB/mm at 50 GHz, respectively. Then, the aerosol-jet printed interconnects were benchmarked with conventional bonding wires while separately interconnecting the ring modulator without the CMOS driver. The measured reflection coefficient (S 11 ) of the aerosol-jet printed interconnects showed an increase in a resonance frequency of 20 GHz compared with Al bonding wires. Furthermore, the optical transmitter was successfully demonstrated at 60 Gb/s and the measured optical eye diagrams were clearly open even after 2 km of standard single-mode fiber. An extinction ratio of 4.63 dB was achieved while applying a drive voltage of 1 V pp .
